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Advances in embedded and fan-out wafer level packaging technologies
3.2.2026

Advances in embedded and fan-out wafer level packaging technologies
  • Sách
  • Keser Beth.
    Advances in embedded and fan-out wafer level packaging technologies / Keser Beth ed.
    Hoboken, New Jersey: Wiley, 2019.
    xxvii, 548 tr, ill.; 24 cm.
  • 9781119314134

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